Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
Company Information
About this company
Key people
Jorge Luis Titinger
Independent Chairman of the Board
Gregory B. Graves
Independent Director
John T. Kurtzweil
Independent Director
Jeanne Quirk
Independent Director
Russell J. Low
President, Chief Executive Officer, Director
David Ryzhik
Interim Chief Financial Officer
Eileen J. Evans
Executive Vice President, General Counsel
Gregory F. Redinbo
Executive Vice President - Marketing and Applications
Gerald M. Blumenstock
Executive Vice President - Research, Development and Engineering
Robert J. Mahoney
Executive Vice President - Global Operations
Christopher J. Tatnall
Executive Vice President - Global Customer Operations
Tzu-Yin Chiu
Independent Director
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Key facts
- Shares in issue30.73m
- EPICACLS
- ISINUS0545402085
- LocationUnited States
- SectorTechnology
- IndustrySemiconductors
- Market cap$4.84bn
- Employees1,465
- ExchangeNASDAQ
- IndexS&P 600 Small Cap, TR Equity United States Index
- Website
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